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We are committed to providing exceptional service through our knowledgeable, passionate, and efficient approach. If customers encounter any maintenance or operational issues, they can contact our after-sales service for technical assistance.
At LP DISPLAY, we prioritize both product quality and service, striving to meet customer needs by attentively listening to feedback and offering dedicated support. Our goal is to ensure customer satisfaction through our after-sales service.
Address : D701, Building 5, Shenzhen Software Industry Base, Haitian Second Road, Nanshan District, Shenzhen, Guangdong, China
Zip code: 518000
Service hotline: +86-755-23502825
Company email: oversea@szlpdisplay.com
Address : 1040 Riverside Parkway, Suite 130 West Sacramento, CA 95605
Zip code: 95605
Contact: Nancy
Tel: 0086-18576606746
Email: nancy@szlpdisplay.com
Address : #07-30 Northpoint Bizhub, Yishun Industrial Street 1, Singapore
Zip code: 768159
Contact: Winnie
Tel: 0086-18892087994
Email: winnie@szlpdisplay.com
Address : 1907, HDS Tower, Cluster F, JLT, Dubai, UAE
Contact: Shawn
Tel: +971-45545326
Mobile: 00971-559419769
Email: shawn@szlpdisplay.com
Address: 1st Floor, 2126 Kromadit Building, Phetchaburi Rd, Bang Kapi, Huai Khwang, Bangkok, Thailand
Zip code: 10310
Contact: Winnie
Tel: 0086-18892087994
Email: winnie@szlpdisplay.com
Address : Kölner Straße 260, 51149, Köln, DE
Zip code: 51149
Contact: Cindy
Email: cindy@szlpdisplay.com
Address : 13 Jalan SILC 2/18, Kawasan Perindustrian SILC, 79200, Iskandar Puteri, Johor Malaysia
Zip code: 79200
Contact: Winnie
Tel: 0086-18892087994
Email: winnie@szlpdisplay.com
Address: 21 Barry street, bayswater, vic 3153, Australia
Contact: Winnie
Tel: 0086-18892087994
Email: winnie@szlpdisplay.com
Fine pitch LED displays feature a small pixel pitch, typically less than 2.5mm, allowing for higher resolution and clearer images at closer viewing distances.
The name “Flip-chip” describes the method used to connect a semiconductor die to a substrate, which contrasts with conventional wire-bonding and ball-grid-array packaging.
In a Flip-chip package the dies are bumped and then “flipped” onto a substrate, hence the name “Flip-chip”, while conventional chip is composed of P-GaN, an active layer, N-GaN and Sapphire substrate from top to bottom.
While some fine pitch displays are designed for indoor use, there are outdoor variations specifically built to withstand environmental elements. Outdoor displays usually have a larger pixel pitch for greater visibility.
Costs can vary significantly based on pixel pitch, size, resolution, and additional features. Generally, fine pitch displays tend to be more expensive than traditional display technologies due to their advanced capabilities.
Power failure; No signal input from the sending card; Error with the received card’s RCFG file; Network cable transmission failure.
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